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Programs : Budget Sheet
The following listing represents the Spring Semester Budget Sheet for Engineering in Hong Kong - University of Hong Kong (HKU).

Spring Semester Budget Sheet for Engineering in Hong Kong - University of Hong Kong (HKU)

Budget Item Illinois Student, Exchange Program Non-Illinois Student
Application Fee *   $25.00 $25.00
Colleges and/or SAO Administrative Fees *   $400.00 $600.00
Program Fee *   $1,750.00 $4,750.00
CISI Insurance *   $127.00 $127.00
Billable subtotal:  $2,302.00 $5,502.00
Housing   $2,500.00 $2,500.00
Meals (full or additional)   $2,500.00 $2,500.00
Books and Supplies   $250.00 $250.00
Local Transportation   $250.00 $150.00
Visa Processing and Immigration   $250.00 $250.00
Roundtrip Airfare   $1,600.00 $1,600.00
Personal/Miscellaneous Expenses   $2,200.00 $2,200.00
Non-billable subtotal:  $9,550.00 $9,450.00
Total: $11,852.00 $14,952.00
Notes:
In addition, you will pay University of Illinois Range IV Tuition, General Fee, and Other Fees.  For details, go to http://www.oar.uiuc.edu/current/financial/tuition.html.      Estimated cost:             $1522

Please note that the above total cost is based partially on estimates and addresses basic necessities and light to moderate social expenses only.  Costs can fluctuate as a result of changes in exchange rates, tuition increases, varying personal lifestyles, etc.                   


                   
IPENG Study Abroad Advisors:  Teresa Finis, Belinda Barnhart, Kimberly Bone, Jana Gadbury      
 
Date:________________         Advisor's Signature: _____________________________________     
                   
(Note:  budget not valid for financial aid purposes without signature of study abroad advisor.)



As a recipient of financial aid from the University of Illinois, I understand that it is my responsibility to report to the Office of Student Financial Aid all scholarships for study abroad that I receive from the University of Illinois and/or any other institution.                   
                   
STUDENT NAME:  _______________________________________   UIN:  _________________

Student Signature:  _____________________________________  Date:  _________________   


I HAVE FILED/WILL FILE FOR STUDENT FINANCIAL AID:        YES:  ________   NO:  _______ 
 


Submit this form to the Office of Student Financial Aid, 620 E. John Street
ONLY If you have filed/will file for Student Financial Aid

Sponsoring institution/foreign univ. and Location:  Hong Kong University, Hong Kong, China
File ID:  HKU-SAO-IPENG Exchange  20080318   
Agreement expiration:  May, 2013     
Prog. Term:  Spring 2014                      Cr. Hrs: 12 (ENG 299 or equivalent)
* Billable item